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1 tga2924-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com -25 -20 -15 -10 -5 0 5 10 15 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3 frequency (ghz) s-parameter (db) key features ? 2. 6 ghz application frequency range ? 12 db nominal gain ? 40 dbm nominal psat ? 2.5% evm at 30 dbm output power ? internally partially matched ? imd3 -45 dbc @ 28 dbm scl, typical ? bias conditions: 8 v @ 1.2 a (quiescent) ? 0.5 m hfet technology ? 2 lead cu-alloy base package fixtured measured performance bias conditions: vd = 8 v, idq =1.2 a performance data taken in a 2.6 ghz application circuit primary applications ? mmds pt-pt and pt-multi pt radio ? s-band power amplifiers the tga2924-sg hpa provides 12 db of gain, 10 w of output power at 2.6 ghz and 2.5% evm at 30 dbm output power. the device is ideally suited for high linearity, high power wireless data applications such as mmds point-to-point or point-to- multi-point radios. the package has a high thermal conductivity copper alloy base. internal partial matching simplifies system board layout by requiring a minimum of external components. lead-free & rohs compliant. evaluation boards are available. product description s21 s11 s22 35.5 36 36.5 37 37.5 38 38.5 39 39.5 40 40.5 2.4 2.45 2.5 2.55 2.6 2.65 2.7 2.75 2.8 frequency (ghz) output power (dbm) p1db p2db 10 watt mmds packaged amplifier datasheet subject to change without notice
2 tga2924-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com table i maximum ratings 1/ symbol parameter value notes vd drain supply voltage 10 v 2 / vg gate supply voltage range 0 v to -5 v idq drain supply current (quiescent) 4 a 2 / | ig | gate current 39 ma p in input continuous wave power 39 dbm 2 / p d power dissipation 14.4 w 2 /, 3 / t ch operating channel temperature 200 c 4/ mounting temperature (30 seconds) 260 c t stg storage temperature -65 to 150 c 1 / these ratings represent the maximum operable values for this device. 2 / combinations of supply voltage, supply current, input power, and output power shall not exceed p d . 3 / when operated at this bias condition with a base plate temperature of 85 c, the median life is 7.5e5 hours. 4/ junction operating temperature will directly affect the device median time to failure (tm). for maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels.
3 tga2924-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com table ii rf characterization table (t a = 25 c, nominal) (vd = 8 v, idq = 1.2 a) symbol parameter test condition typical units gain small signal gain f = 2.6 ghz 12 db irl input return loss f = 2.6 ghz 6 db orl output return loss f = 2.6 ghz 10 db psat saturated output power 40 dbm
4 tga2924-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com table iii thermal information parameter test conditions t ch (c) jc (c/w) tm (hrs) jc thermal resistance (channel to backside of package) vd = 8 v i d = 1.2 a pdiss = 9.6 w 162 8 3.5 e+7 note: package backside snpb soldered to carrier at 85 c baseplate temperature. at saturated output power, the dc power consumption is 20w with 10w rf power delivered to the load and 10w dissipated. a dding the 1w rf input power results in 11w total power dissipation and a maximum channel temperature of 173 c at 85 c baseplate temperature. median lifetime (tm) vs. channel temperature
5 tga2924-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com bias conditions: vd = 8 v, idq = 1.2 a measured fixtured data application circuit tuned to 2.6 ghz
6 tga2924-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com bias conditions: vd = 8 v, idq = 1.2 a measured fixtured data application circuit tuned to 2.6 ghz 0 5 10 15 20 25 30 35 40 45 50 19 21 23 25 27 29 31 33 35 pin (dbm) pae (%) 2.45ghz 2.5ghz 2.55ghz 2.6ghz 2.65ghz 2.7ghz 2.75ghz 1200 1400 1600 1800 2000 2200 2400 19 21 23 25 27 29 31 33 35 pin (dbm) id (a) 2.45ghz 2.5ghz 2.55ghz 2.6ghz 2.65ghz 2.7ghz 2.75ghz
7 tga2924-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com bias conditions: vd = 8 v, idq = 1.2 a measured fixtured data application circuit tuned to 2.6 ghz
8 tga2924-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com bias conditions: vd = 8 v, idq = 1.2 a measured fixtured data application circuit tuned to 2.6 ghz
9 tga2924-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com side view bias procedure 1. ensure no rf power is applied to the device. 2. pinch off device by setting vg to ?3v. 3. increase vd to 8.0v while monitoring drain current. 4. increase vg until drain current reaches 1.2a 5. apply rf power. mechanical drawing top view note: all dimensions are in in ches with 5 mil tolerance 0.068 vg vd
10 tga2924-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com 2.6 ghz application circuit schematic pcb is 20 mil thick rogers 4003 substrate
11 tga2924-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com typical evaluation board layout * *the layout is a general purpose drawing that needs to be tuned for the specific application. pcb is ro4003 20 mil thickness, 0. 5 oz standard copper cladding, with r = 3.38. contact triquint applications engineering for additional info external component listing part type reference description capacitor c1 avx 06035j5r6bbt, 5.6 pf capacitor c2 avx 06035j5r6bbt, 5.6 pf capacitor c3 4.7uf capacitor c4 avx 06035j8r2bbt, 8.2 pf capacitor c5 avx 06035j8r2bbt, 8.2 pf resistor r1 0805, 10 c1 c2 c3 c4 c5 r1 207 mil 518 mil 1095 mil 902 mil vg vd in out
12 tga2924-sg may 2009 ? rev - triquint semiconductor: www. tri quint.com (972)994- 8465 fax (972)994-8504 info-mmw@tqs.com recommended surface mount package assembly proper esd precautions must be followed while handling packages. clean the board with acetone. rinse with alc ohol. allow the circuit to fully dry. triquint recommends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors? recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering is not recommended. solder paste c an be applied using a stencil printer or dot placement. the volume of solder paste depends on pcb and component layout and should be well controlled to ensure consistent mechanical and electrical performance. clean the assembly with alcohol. typical solder reflow profiles reflow profile snpb pb free ramp-up rate 3 c/sec 3 c/sec activation time and temperature 60 ? 120 sec @ 140 ? 160 c 60 ? 180 sec @ 150 ? 200 c time above melting point 60 ? 150 sec 60 ? 150 sec max peak temperature 240 c 260 c time within 5 c of peak temperature 10 ? 20 sec 10 ? 20 sec ramp-down rate 4 ? 6 c/sec 4 ? 6 c/sec part package style tga2924-sg gullwing leads ordering information

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